Tecno just unveiled a rather intriguing modular smartphone concept design at MWC 2026. The standout feature here is likely ...
AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology ...
TECNO is getting ready to showcase an ultra-thin modular smartphone at MWC 2026 that measures only 4.9mm and comes with slim attachments.
Airbus Helicopters has offered more detail on the design choices behind its two concept studies produced for the NATO Next ...
Tecno has introduced a new modular smartphone concept at MWC 2026, highlighting an ultra-thin base design and a magnetic attachment system for expandable ...
Chinese smartphone maker Tecno is channeling Project Ara with its latest Modular Phone concept, previewed ahead of MWC 2026.
The rear of the main device is mapped into eight modular zones, guiding the placement of accessories to ensure they align perfectly with the magnetic array and pogo-pin connectors. So far, the modular ...
While components in most desktop computers can be easily — well, relatively easily — replaced, laptops tend to be far more difficult to upgrade or replace. Intel is pushing a modular concept that ...
Guessing Headlights on MSN
Fiat Topolino XS concept imagines a modular micro electric car
Designer Wini Camacho imagines an ultra-compact electric Topolino that reconfigures via removable roof, windshield, and side panels. With carved-in LEDs, a fixed-core steering concept, and a 2.4m ...
1don MSN
Tecno’s Modular Phone Concept is a Super Slim 4.9 mm Device With Magnetic How-Swap Attachments
Just before the Mobile World Congress (MWC) 2026 event in Barcelona, Tecno unveiled a bold new smartphone concept that is built around the new Modular Magnetic Interconnection Technology. This is a ...
Due to their sturdy construction designed to endure the roughest weather, cover long ranges, and operate autonomously for months at sea, and do so while offering guests onboard luxury amenities, ...
The mobile device manufacturer showcased a prototype design featuring interchangeable components in an ultra-slim form factor at a technology exhibition.
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