The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...

This FAQ will look at how a PC board loaded with anywhere from just a few to hundreds of components is soldered in one smooth process, and the fascinating technology and systems it takes to do that.

A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...