The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.

Silicon carbide (SiC) continues to carve out a place for itself in power electronics after decades of dominance by silicon. SiC-based power switches are becoming the gold standard in the three-phase ...

A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...

Dublin, Jan. 28, 2026 (GLOBE NEWSWIRE) -- The "Power Discrete and Module Market Report 2026" has been added to ResearchAndMarkets.com's offering. The report offers insights into market size, regional ...