NSS with ML-KEM and ML-DSA algorithms passes lab testing and enters Modules in Process list, making Rocky Linux from CIQ one ...
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Abstract: A new concept for encapsulation of discrete bipolar high-power devices using epoxy mold compound (EMC) is demonstrated on silicon 4.5-kV press-pack fast recovery diodes (FRDs) with wafer ...
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
You will be redirected to our submission process. The development of food products within the food industry is increasingly driven by evolving consumer preferences, retailer requirements, and ...
JASM is an assembler/disassembler for JVM bytecode. It provides a nice syntax for writing JVM classes in a bytecode-focused assembly language, and can also disassemble any Java .class file to JASM ...
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