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The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

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Abstract: A novel ultrawideband parallel-plate (PP) horn array with an air-filled single-ridge waveguide (SRW) feed network is presented. By designing a wideband double 90°-bend single-to-double (STD) ...